Jr., Antonio R. Sumagpang and Jr., Edwin M. Graycochea and Gomez, Frederick Ray I. (2020) Flux Shorting Mitigation on Semiconductor BGA Device through Process Design Enhancement. Journal of Engineering Research and Reports, 19 (3). pp. 1-5. ISSN 2582-2926
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Abstract
With the new and upcoming technologies in semiconductor industry, packages like the ball grid array (BGA) are getting more challenging to process due to inherent issues that come along. Process improvement through modification in the design of indirect material is one key direction to improve the productivity during assembly manufacturing. In this paper, an enhanced design of dipping plate is presented to solve the issue of flux shorting due to out-of-specs dipping plate at ball attach process. The study used a side by side comparison to prove that the new design is better than that of the out-of-specs indirect material. With the new enhanced design of dipping plate and the optimized flux depth parameter, flux shorting occurrence was successfully mitigated.
Item Type: | Article |
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Subjects: | OA Library Press > Engineering |
Depositing User: | Unnamed user with email support@oalibrarypress.com |
Date Deposited: | 19 Apr 2023 06:51 |
Last Modified: | 09 May 2024 12:32 |
URI: | http://archive.submissionwrite.com/id/eprint/400 |